Canteliver Probe Card
MPI Cantilever Probe Card is broadly applied on gold bump and pad wafer screening for Display screen driver, logic, and memory unit. MPI’s cantilever probes would be the corresponding remedy to the needs of fine pitch, modest pad sizing, high speed, a lot less cleansing, multi-DUT, superior pin depend, and extremely-low leakage needs. With fantastic craftsmanship, ground breaking architecture and proven methodologies depending on mechanical and electrical simulation/measurement final results, generating MPI the highest cantilever company around the globe.
FCB Probe Card
The FCB Probe Card is easily the most experienced know-how of buckling beam probe card. It can be aimed to accomplish the semiconductor ship manufacture time-to-current market (TTM) and value of take a look at (COT) desire. FCB can be a established Resolution for many different semiconductor manufacturing tests from early engineering pilot-operates to significant volume manufacturing (HVM). FCB is prepared for product necessitating large signal integrity probing (SI) and/or energy integrity probing (PI). Applications include cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, plus more. FCB assures the whole world’s finest All round cost-of-possession (COO) for different DUT purposes.
EVS Probe Card
The EVS Probe Card is really an enhancement around the traditional buckling beam probe card. Key options are increased present carrying ability (C.C.C.) and reduced well balanced Speak to drive (BCF), and also General MEMS-like properties. EVS can easily meet the prerequisite of Sophisticated wafer probing. Specific alignment and outstanding planarity Management would be the vital elements contributing to steady contact resistance. With its capability and general performance, EVS Probe Card is a great option for Sophisticated probe cards.
Osprey probe card
The Osprey probe card is MPI’s Option to demand for ever finer pitch. It is created for smaller Al pad, which is ideal for tiny pitch application with peripheral and whole array sample. With specific alignment and much better planarity Regulate, Osprey can reach larger productiveness by multi-DUT style and design. The forming wire (FW) kind needle developed with MPI’s individual micro fabrication system not only delivers large-good quality general performance but will also allows simple needle substitute and shortens keeping cycle time.
Kestrel Probe Card
The Kestrel Probe Card is supplied with MEMS wire (MW) needle that's created for the desire of very low pressure probing. What's more, it comes along with the opportunity to satisfy large C.C.C. and large pin counts application. The MEMS procedure ensures highly dependable needle characteristics, and the Distinctive framework layout enables specific alignment and planarity Regulate.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing check here and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/